Structural designs also can take temperature into account.įigure 5: Iso-surface visualization of fan's cooling capacity Modern chips generate a lot of heat, and so simulation in Solid Edge now handles the impacts from air flow and cooling of fans, shown as temperature curves and iso-surfaces that represent air flow direction, velocity, and temperature. Package Creator defines the packaging and solder points of chips. Simulation. The 2021 release adds electronics air cooling analysis from Simcenter's FLOEFD fluid simulation module.

Decals lets you place images and logos, even across multiple faces. Sheetmetal. Multiple edges receive flanges just by selecting them and then pulling, and partial flanges can be constructed. Nesting now optimizes parts placement on unusual shapes, like cow hides. Internal relationships (like constraints) are now remembered when copying and pasting parts from one assembly to another.įrames can have gaps to allow for welds, and semi-automatically add inward or outward end-caps with optional offsets and chamfers. Modeling. To make large assemblies faster, all parts are kept in a single assembly file. Let me run down highlights for some of the other new features: Sub-d modeling is included with both the Classic and Premium versions of Solid Edge 2021, so you don't pay extra for it. Here, Siemens offers Convergent Modeling, its take on allowing disparate data to exist in a single model, including generative and reverse-engineered (3D scans) ones. Figure 4: Mirrored subdivision modeling in Solid Edge 2021Īrriving at a curvy mouse or camera body is faster with sub-d modeling than with solid modeling, but eventually the mesh needs to work with solids.

Siemens autocad electrical library 2021